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Part 2 will cover: Organizing power areas and ground returns, Extracting scenarios from detailed physical layout, Re-using high-speed channel placement, Creating topology templates, Setting constraints, Simulating and analyzing in-depth

Part 1 will cover: Organizing schematics for high-speed design, High-speed scenarios in the front end, Choosing signal topologies, Planning for controlled impedance, Checking expected high-speed performance by simulation.

The Intelligent PDF Output video demonstrates options for PDF output in eCADSTAR and describes some of the things they are useful for.

Speed up multi-channel layout by replicating template component placement.

The eCADSTAR product is a new product development that takes advantage of the new technology we all use and take for granted today. Come and see how eCADSTAR combines the power of modern Electronic Design Automation (EDA) software and the flexibility of the internet.

Innovation is at the heart of everything we do. Connecting you with the world is our highest priority. Go beyond the bounds of expectation!

Run the Interactive Tour available from the software to introduce you to eCADSTAR

Is your PCB design high-speed? Even using standard components like DDR3, DDR4 or DDR5 SDRAMs means following high-speed PCB design guidelines. Let’s route some DDR3 memory.

Maybe you need to move or change a part. Maybe there’s an update to your PCB’s enclosure. You can check collisions and spacings while you work, in real-time 3D.

In this video we are going to focus on eCADSTAR flexibility suppress unconnected inner-layer pads.

In this video we’re going to take a quick look at the versatility eCADSTAR offers designers with respect to Thermal pad connections.

In this video we take a look at eCADSTAR’s ability to be able to automatically flood copper areas with vias.